PJ-TALD-300

The ALD (Atomic Layer Deposition) System is an independently controllable thin film growth device, it enables fully automatic process control and includes a complete safety interlock function. ALD is used in a wide range of applications, such as high K-gate oxide layers, storage capacitive dielectrics, high aspect ratio diffusion barrier layers in copper interconnects, OLED pinhole-free passivation layers, MEMS high uniform coatings, nanoporous structure coatings, special optical fiber doping, solar cells, flat panel displays, optical films and other special structure nanofilms.